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Saskatchewan will need between $20 billion and $40 billion in improvements over the next 20 years, but little is being done to make sure those funds will actually be put toward infrastructure improvements, according to a recent report.
Roughly $10 billion is being spent on repairing roads in Saskatchewan — but only $10.5 billion of that is going towards major projects, leaving the province with $2.5 billion worth of neglected infrastructure.
A federal agreement to put $38 billion of infrastructure funding toward shoring up national priorities was reached last year, but Saskatchewan still needs more resources.
The report from the Canadian Centre for Policy Alternatives calls on the federal government to put more money into infrastructure and create new federal revenue sources.
It also suggests the province take a serious look at using its own revenues to fund infrastructure upgrades instead of depending on Ottawa.1. Field of the Invention
The present invention relates to a thin film transistor substrate and a display device having the same.
2. Description of the Related Art
A thin film transistor substrate is widely used for a flat panel display device, such as an organic light emitting diode display, an inorganic electroluminescent display, and a liquid crystal display. The thin film transistor substrate includes a plurality of thin film transistors (TFTs) and can be divided into a display region in which a plurality of pixel electrodes are disposed and a non-display region in which a plurality of gate lines and data lines are disposed.
Each of the TFTs is provided with a gate electrode connected to one of the gate lines, a source electrode connected to one of the data lines,
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Загрузил перевод HD Online Player (Intervideo Windvr 3 Crack Rar Filein).1. Technical Field
This invention generally relates to semiconductor chip package technology and more specifically relates to a method for forming a low-stress die attach adhesive tape for semiconductor chip packaging applications.
2. Background Art
Modem semiconductor chips are typically made from silicon or gallium arsenide and are widely used in many applications, ranging from computers to automobiles to consumer products.
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